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IEEE/CAA Journal of Automatica Sinica被SCI,，EI，Scopus，DBLP等數(shù)據(jù)庫(kù)收錄，入選中國(guó)科技期刊卓越行動(dòng)計(jì)劃世界一流重點(diǎn)建設(shè)期刊、中國(guó)科協(xié)自動(dòng)化領(lǐng)域T1級(jí)高質(zhì)量科技期刊、計(jì)算領(lǐng)域高質(zhì)量科技期刊T1類(lèi)（最頂級(jí)）、中國(guó)科技核心期刊、ESI刊源期刊，自首次參評(píng)以來(lái)已連續(xù)五年榮獲“中國(guó)最具國(guó)際影響力學(xué)術(shù)期刊”稱(chēng)號(hào)（Top5%）。

IEEE/CAA Journal of Automatica Sinica是中科院期刊分區(qū)工程技術(shù)和計(jì)算機(jī)科學(xué)類(lèi)一區(qū)Top期刊；2021年SCI影響因子7.847，在自動(dòng)化與控制領(lǐng)域排名全球第7（前10%)，是該領(lǐng)域唯一的中國(guó)主辦Q1區(qū)SCI期刊；2021年CiteScore為13.0，在控制與優(yōu)化領(lǐng)域排名全球第1，在計(jì)算機(jī)信息系統(tǒng)、控制與系統(tǒng)工程、人工智能領(lǐng)域分別排名前5%-7%，均位于Q1區(qū)前列，；全球TOP1000期刊榜單計(jì)算機(jī)與電子領(lǐng)域排名世界前12%、中國(guó)第1；谷歌學(xué)術(shù)計(jì)量自動(dòng)化與控制理論學(xué)科頂級(jí)出版物中排名全球第7，是該學(xué)科TOP20出版物中世界最年輕且唯一中國(guó)主辦的期刊。

期刊主頁(yè)：http://www.ieee-jas.net

在線(xiàn)投稿：https://mc03.manuscriptcentral.com/ieee-jas

編委會(huì)：https://www.ieee-jas.net/news/Current.htm

聯(lián)系方式

聯(lián)系人：歐彥

電話(huà)：010-82544459

email：yan.ou@ia.ac.cn     

主編   

Qing-Long Han   Swinburne University of Technology, Australia

副主編  

Derong Liu   Guangdong University of Technology, China    

Zhongping Jiang   New York University, USA    

Qinglai Wei    Chinese Academy of Sciences, China    

編委

Cesare Alippi   Politecnico di Milano, Italy

Panos J. Antsaklis   University of Notre Dame, USA

Tamer Basar   University of Illinois, USA

Dimitri P. Bertsekas   Massachusetts Institute of Technology, USA

Bijnan Bandyopadhyay  Indian Institute of Technology Bombay, India

Zhengcai Cao   Beijing University of Chemical Technology, China

Long Chen   University of Macau, Macau

C. L. Philip Chen   University of Macau, Macau

Mo-Yuen Chow  Shanghai Jiaotong University, China

L. Chen  Sun Yat-sen University, China

Weiping Ding   Nantong University, China

Daoyi Dong   University of New South Wales, Australia

Giuseppe Franzè   University of Calabria, Italy

Shangce Gao University of Toyama, Japan

Weinan Gao Florida Institute of Technology, USA

Fengling Han   Royal Melbourne Institute of Technology, Australia

Wei He   University of Science & Technology Beijing, China

Zengguang Hou   Chinese Academy of Sciences, China

Tingwen Huang  Texas A&M University at Qatar, Qatar

Biao Huang  University of Alberta, Canada

Frank L. Lewis   The University of Texas at Arlington, USA

Hongyi Li  Guangdong University of Technology, China

Shuai Li   Swansea University, UK

Chenglin Liu    Chinese Academy of Sciences, China

Honghai Liu  University of Portsmouth, UK

Lichuan Liu   Northern Illinois University, USA

Xiaoping Liu    Carleton University, Canada

Yan-Jun Liu    Liaoning University of Technology, China

Xin Luo    Chinese Academy of Sciences, China

Yan Lu   NIST, USA

Antonio Marcus Nogueira Lima  Universidade Federal de Campina Grande, Brazil

Xiaoxiang Na   University of Cambridge, UK

Thomas Parisini   University of Trieste, Italy

Marios M. Polycarpou    University of Cyprus, Cyprus

Xuemin Shen   University of Waterloo, Canada

Jinhua She  Tokyo University of Technology, Japan

Lei Shu    University of Lincoln, UK

Zhen Song   Siemens Corporation, USA

Fei-Yue Wang    Chinese Academy of Sciences, China

Jiacun Wang   Monmouth University, USA

Shouguang Wang  Zhejiang Gongshang University, China

Zidong Wang   Brunel University London, UK

Donald C. Wunsch II   Missouri University of Science and Technology, USA

Yang Xiang  Swinburne University of Technology, Australia

Peter Xiong   Microsoft, USA

Tao Yang  Northeastern University, China

Hui Yu  Pouthmoth University, UK

Huaguang Zhang  Northeastern University, China

Jun Zhang   Denver University, USA

Nian Zhang   University of the District of Columbia, USA

Jinyun Zhang   Mitsubishi Electric Research Laboratories, USA

Mengchu Zhou  New Jersey Institute of Technology, USA